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Download Electronic Packaging Materials Science IX: Volume 445 (MRS Proceedings) fb2, epub

by Steven K. Groothuis,Paul S. Ho,Kenzo Ishida,Tien Wu

Download Electronic Packaging Materials Science IX: Volume 445 (MRS Proceedings) fb2, epub

ISBN: 1558993495
Author: Steven K. Groothuis,Paul S. Ho,Kenzo Ishida,Tien Wu
Language: English
Publisher: Materials Research Society; 1 edition (October 20, 1997)
Pages: 322
Category: Engineering
Subcategory: Engineering
Rating: 4.4
Votes: 847
Size Fb2: 1890 kb
Size ePub: 1399 kb
Size Djvu: 1976 kb
Other formats: azw txt rtf lrf


Steven K. Groothuis, Paul S. Ho, Kenzo Ishida.

Steven K. While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability.

Ho, Kenzo Ishida, and Tien. This volume in the series on elec-. tronic packaging materials science. based on papers presented at the De-. cember 1996 MRS meeting, with a spe

Ho, Kenzo Ishida, and Tien. is. cember 1996 MRS meeting, with a spe-. cial focus on technology for flip-chip. packaging, materials metrology and. characterization, and packaging reli-.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing.

Electronic Packaging Materials Science IX. . Ho, K. Ishida, T. Wu. Volume 445 - 1996. Page/Article number Title Type Online publication date. The results explain well the recent experimental observations. Microstructure and Reliability of Sputter Deposited Cr-Crcu-Cu thin Films for Flip-Chip Applications. Na Zhang, Mark Mcnicholas, Neil Colvin.

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, MassachusettsĀ .

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, . While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technolog. More). Stress Simulation in Area Array Packaging. Steven K. Groothuis, Nick Hassanzadeh, Les Stark.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. Be the first to ask a question about Electronic Packaging Materials Science Ix. Lists with This Book. This book is not yet featured on Listopia.

Symposium on Electronic Packaging Materials Science (9th : 1996 : Boston, Mass.

Edwin D Lillie, P Ho, E D Lillie

Edwin D Lillie, P Ho, E D Lillie.

Cotts, Electronic Packaging Materials Science IX, eds. Boston: MRS, 1997), p. 3. oogle Scholar. 6. K. Zeng, R. Stierman, . Chiu, D. Edwards, K. Ano, and .

Are you sure you want to remove Electronic Packaging Materials Science IX from your list? Electronic Packaging Materials Science IX. Symposium Held December 2-5, 1996, Boston, Massachusetts, . by Robert C. Sundahl. Materials, Congresses, Electronic packaging.

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

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